CHIPS Permittivity coupons and on-wafer calibration standards – Combined Sources Sought/Notice of Intent to Sole Source

Solicitation description

***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE*** The National Institute of Standards and Technology (NIST) is seeking information from sources that may be capable of providing a high speed, Lock-in/Servo system. If no alternate sources are identified, the Government intends to issue a Sole Source Award to Mosaic Microsystems LLC, 500 Lee Rd, Suite 200, Rochester, NY 14606 (UEI: JPLDLBVEEUP2) under the authority of FAR 12.102(a). The North American Industry Classification System (NAICS) code for this acquisition is 334413, NIST has a need for a permittivity coupons and on-wafer calibration standards that meets or exceeds the following draft minimum specifications: The National Institute of Standards and Technology (NIST) propose a contract to purchase wafers and fabrication services with an option year for high purity fused silica coupons and wafer fabrication. These wafers and fabrication services build a collection of standard reference materials (SRMs). The SRMs support on-wafer power, phase, S-parameters, and complex permittivity. The goal of this requirement is to enable traceable complex measurement and on-wafer traceability for S-parameters power and phase for NIST. The contractor shall deliver the twenty (20) Wafers for NIST wafer-level calibration kits; thirty (30) 150 um Standard reference material permittivity coupons; ten (10) 160 um Standard reference material permittivity coupons; ten (10) 140 um Standard reference material permittivity coupons; five (5) Exploratory standard reference material microstrip calibration kits. Optional line items include five (5) Exploratory standard reference material coplanar waveguide calibration kits; twenty (20) Additional Wafers for NIST wafer-level calibration kits; thirty (30) Additional 150 um Standard reference material permittivity coupons. Description: Wafers for NIST wafer-level calibration kits Quantity: 20-55 Technical Specifications High purity fused silica 150 mm (6 inch) Less than TTV 0.05 mm over 200 mm 150 um thick Handles wafers Viaffirm Laser cutting and healing etch of center coupon after NIST fabrication Stealth dicing after NIST fabrication Glass wafer debond after NIST fabrication Singulation into individual die Storage into a die holder Shipping back to NIST after singulation Description: 150 um Standard reference material permittivity coupons Quantity: 30-70 Technical Specifications High purity fused silica 200 mm (8 inch) Less than TTV 0.05 mm over 200 mm 150 um laser cutting and healing etch Description: 160 um Standard reference material permittivity coupons Quantity: 5 Technical Specifications High purity fused silica 200 mm Less than TTV 0.05 mm over 200 mm 160 um laser cutting and healing etch Description: 140 um Standard reference material permittivity coupons Quantity: 5 Technical Specifications High purity fused silica 200 mm Less than TTV 0.05 mm over 200 mm 140 um laser cutting and healing etch Description: Exploratory standard...

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